# @stem_antics on Instagram

- **Type:** Video
- **Original URL:** https://www.instagram.com/p/DY78D2RSw5f
- **Gondola URL:** https://gondola.cc/posts/66053060-stem-antics-instagram
- **Thumbnail:** https://img.gondola.cc/tr:w-,h-,fo-auto/postThumbnails/2457dcf9ff.jpg
- **Posted:** 2026-05-29T20:50:45.000+00:00
- **Account Owner:** Stem Antics (@stem_antics) — https://gondola.cc/stem_antics

## Caption

PCB potting is the process of encapsulating an assembled board in a cured polymer compound, completely surrounding components to protect against moisture ingress, mechanical shock, vibration fatigue, thermal cycling, and chemical attack. At its core, it’s about converting a mechanically and environmentally vulnerable assembly into a sealed, monolithic structure.

The most common potting materials in high-volume manufacturing:

	•	Epoxy thermosets — highest mechanical strength and chemical resistance, excellent adhesion to FR4 and metal housings, but brittle under thermal cycling
	•	Polyurethane — more flexible than epoxy, better for wide-temperature-range applications, good dielectric properties
	•	Silicone — outstanding thermal range (-60°C to 200°C+), flexible, but lower adhesion and harder to rework
	•	UV-cure acrylics — used for selective or conformal applications where full encapsulation isn’t required

At manufacturing scale, potting is typically performed with two-component meter-mix-dispense (MMD) systems. A and B component resins are stored in separate reservoirs, pumped through precision gear or piston metering heads at exact volumetric ratios — typically 1:1 to 10:1 depending on resin chemistry — and combined in a static mixer before dispensing into the housing cavity. Mix ratio accuracy directly controls cure kinetics and final crosslink density; a 2–3% ratio deviation can produce soft spots, exotherms, or incomplete cure.

Degassing is non-trivial. Entrapped air in the mixed resin creates voids that act as stress concentrators under thermal cycling and can compromise IP ratings. Vacuum potting chambers pull the assembly below atmospheric pressure before and during fill, drawing air out of component cavities and solder joint gaps before the resin wicks in and cures.

#stemantics #pcbdesign #electronicsmanufacturing #embeddedsystems #engineeringmanufacturing

## Stats

- **Views:** 7,872
- **Likes:** 121
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- **Comments:** 1

## Tags

electronicsmanufacturing, embeddedsystems, engineeringmanufacturing, pcbdesign, stemantics

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