# @tiffintech on Instagram

- **Type:** Video
- **Original URL:** https://www.instagram.com/p/Dc01wRhRH3Q
- **Gondola URL:** https://gondola.cc/posts/69961655-tiffintech-instagram
- **Thumbnail:** https://img.gondola.cc/tr:w-,h-,fo-auto/postThumbnails/2fbe4c4887.jpg
- **Posted:** 2026-09-03T12:45:33.000+00:00
- **Account Owner:** Tiffany Janzen (@tiffintech) — https://gondola.cc/tiffintech

## Caption

The next computing revolution might  come from stacking chips like high rises. 

 Building a computer chip takes heat that would melt the wiring already inside it. 

That’s why processors are still built one layer thick. 

The University of Illinois just rolled 10-nanometer sheets of silicon onto a chip like a sticker, at a fifth of the temperature, and got three working stacked layers. 

If this holds up in a real foundry, chips keep getting denser without transistors getting any smaller.

Sources:
Lam, B. et al., “Monolithic three-dimensional integration of silicon transistors,” Nature (2026), DOI 10.1038/s41586-026-10496-6

O’Boyle, M., “A new way to build chips: Sequentially stacking silicon to extend Moore’s law,” University of Illinois Grainger College of Engineering, May 26, 2026

#Tech #stem #technology

## Stats

- **Views:** 92,045
- **Likes:** 2,135
- **Shares:** 0
- **Comments:** 35

## Tags

stem, technology, tech

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