Google connected 9,216 AI chips and not with traditional electrical switches, but with mirrors. 🪞 Inside their Ironwood TPU pods, microscopic MEMS mirrors physically tilt to redirect light beams between chips. No light to electricity conversion. No switching overhead. Just data, moving at the speed of light. And if a chip fails? You don’t rewire anything. You just change the angle of the mirror. For the engineers in my comments who want the full picture: short distance links within the 4×4×4 cube clusters still use copper, the MEMS mirrors handle the optical switching between cubes at pod scale. The nuance matters, and I see you. This is why the interconnect problem is the most important race in AI infrastructure right now. The chip is no longer the bottleneck. The connection between chips is. 📚 Want to go deeper? Search: → “Inside the Ironwood TPU codesigned AI stack” Google Cloud Blog (official) → “TPU7x Google Cloud documentation” official Google Cloud docs → “TPUv7 Google t...