PCB potting is the process of encapsulating an assembled board in a cured polymer compound, completely surrounding components to protect against moisture ingress, mechanical shock, vibration fatigue, thermal cycling, and chemical attack. At its core, it’s about converting a mechanically and environmentally vulnerable assembly into a sealed, monolithic structure. The most common potting materials in high-volume manufacturing: • Epoxy thermosets — highest mechanical strength and chemical resistance, excellent adhesion to FR4 and metal housings, but brittle under thermal cycling • Polyurethane — more flexible than epoxy, better for wide-temperature-range applications, good dielectric properties • Silicone — outstanding thermal range (-60°C to 200°C+), flexible, but lower adhesion and harder to rework • UV-cure acrylics — used for selective or conformal applications where full encapsulation isn’t required At manufacturing scale, potting is typically performed with two-component mete...