The next computing revolution might come from stacking chips like high rises. Building a computer chip takes heat that would melt the wiring already inside it. That’s why processors are still built one layer thick. The University of Illinois just rolled 10-nanometer sheets of silicon onto a chip like a sticker, at a fifth of the temperature, and got three working stacked layers. If this holds up in a real foundry, chips keep getting denser without transistors getting any smaller. Sources: Lam, B. et al., “Monolithic three-dimensional integration of silicon transistors,” Nature (2026), DOI 10.1038/s41586-026-10496-6 O’Boyle, M., “A new way to build chips: Sequentially stacking silicon to extend Moore’s law,” University of Illinois Grainger College of Engineering, May 26, 2026 #Tech #stem #technology